Chipbond Technology Corp.

Chipbond Technology Corp. offers end‑to‑end driver IC and non‑driver IC packaging, bumping, and wafer processing in Taiwan and China, supplying SiGe, GaAs, GaN, and SiC substrates and advanced packaging for LCD, sensor, and AI markets.

Headquarters: Taiwan (TWN)

Website: Visit Site 🔗
Type: Corporation

Company Profile

Sector: Manufacturing
Industry: Semiconductor Manufacturing

HQ: Hsinchu City

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Symbol	Name	Type	Exchange	Currency	ISIN	Status	Actions
6147	Chipbond Technology Corp. Cap: 43.5B \| P/E: 15.4	EQUITY	TWO	TWD	TW0006147002	Active	📈